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SEMIFIVE Collaborates with OPENEDGES on Chiplet Development

Developing HPC Chiplet Platform to Feature LPDDR6 Memory Interface SEOUL, South Korea, June 13, 2024 /PRNewswire/ — SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding…

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SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform

The HPC platform to be built on Samsung SF4X with LPDDR6 Memory Interface SEOUL, South Korea, June 12, 2024 /PRNewswire/ — SEMIFIVE, a leading SoC design platform, announced today it has joined Arm Total Design and will begin developing…

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SEMIFIVE Collaborates with MetisX in Developing CXL-based Memory Accelerator Chip

– Collaboration on prototype design and mass product development with Samsung Foundry’s 4nm process technology SEOUL, South Korea, April 25, 2024 /PRNewswire/ — SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced…

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SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product

Delivered Mobilint’s ARIES high performance custom SoC built on Samsung Foundry’s leading 14nm FinFET process technology SEOUL, South Korea , March 27, 2024 /PRNewswire/ — SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions,…

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OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform

Seoul, South Korea — March 11, 2024 — OPENEDGES Technology, Inc. (OPENEDGES, KOSDAQ: 394280), a total memory subsystem IP provider, proudly unveils a strategic partnership with SEMIFIVE to establish a user-friendly SoC ecosystem, integrating silicon-proven IPs…

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SEMIFIVE Collaborates with HyperAccel in Developing AI Chip

Collaboration on prototype design and development by using Samsung Foundry’s 4nm process technology SEOUL, South Korea, Jan. 10, 2024  — SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a…

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