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[단독] TSMC처럼…주문형 반도체 위탁 설계
“올 연말 고성능 3D(차원) 집적회로(IC) 칩 개발을 완료할 것입니다.”
조명현 세미파이브 대표는 31일 경기 성남시 사무실에서 진행한 인터뷰에서 “고대역폭메모리(HBM)4 8개를 합친 것보다 대역폭이 넓고 전력 소모는 더 적은 제품”이라며 올 연말 선보일 반도체 신제품을 설명했다. 그는 “이 제품이 인공지능(AI) 반도체 시장의 게임 체인저가 될 것”이라고 자신했다.
Source:
The Korea Economic Daily

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