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Press Release
Developing HPC Chiplet Platform to Feature LPDDR6 Memory Interface SEOUL, South Korea, June 13, 2024 /PRNewswire/ — SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Technology (OPENEDGES). This strategic partnership is dedicated to developing an advanced chiplet platform that incorporates OPENEDGES LPDDR6…
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
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Press Release
– Acclaimed Industry Veteran to Lead Market Entry and Global Expansion Initiatives SEOUL, South Korea, Jan. 4, 2024 — SEMIFIVE, a leading semiconductor design partner and pioneer of platform-based custom silicon solutions, has announced the appointment…
Renowned Japanese Semiconductor Specialist Joins SEMIFIVE
Press Release
Expected to be a bridgehead for entering the Japanese market SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of MOU with Japan-based TeraPixel Technologies, on October 16,…
SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design
Press Release
Continues expansion into one of the fastest growing global regions deploying custom chips SAN JOSE, Calif., August 08, 2023- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced the…
SEMIFIVE Enters China Market with New Office in Shanghai, China
Update
“더 많은 회사가 인공지능(AI) 전용 반도체를 직접 만들려고 할 겁니다. 기술력을 갖춘 회사들이 지금보다 적은 비용으로 차별화된 반도체를 개발할 수 있도록 기존 반도체 설계 방식을 근본적으로 바꿔가겠습니다.” 조명현 세미파이브 대표는 최근 한국경제신문과의 인터뷰에서 “자체 반도체를…
조명현 세미파이브 대표 “재사용·자동화로 AI 반도체 설계 비용 확 줄였죠”
Source: The Korea Economy Daily
Update
SEMIFIVE achieved ISO 9001:2015 certification for design, development and outsourced production of semiconductor IC & Solution Development on May 9th, 2023.
SEMIFIVE Awarded ISO9001 Certification
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