{"id":5590,"date":"2024-11-12T01:07:10","date_gmt":"2024-11-12T01:07:10","guid":{"rendered":"https:\/\/semifive.com\/?post_type=press-releases&#038;p=5590"},"modified":"2025-12-31T14:57:54","modified_gmt":"2025-12-31T05:57:54","slug":"semifive-collaborates-with-synopsys-to-develop-advanced-chiplet-platform-for-high-performance-multi-die-designs","status":"publish","type":"press-releases","link":"https:\/\/semifive.com\/ko\/company\/newsroom\/press-releases\/semifive-collaborates-with-synopsys-to-develop-advanced-chiplet-platform-for-high-performance-multi-die-designs\/","title":{"rendered":"SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs"},"content":{"rendered":"\n<ul class=\"wp-block-list\">\n<li><strong><em>The Platform Helps Meet PPA Goals and Accelerate Time-to-Market<\/em><\/strong><\/li>\n<\/ul>\n\n\n\n<p class=\"has-small-font-size wp-block-paragraph\"><strong>SEOUL, South Korea,&nbsp;Nov. 12, 2024&nbsp;\/PRNewswire\/ &#8212; SEMIFIVE<\/strong>, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced their collaboration with Synopsys to develop a cutting-edge high-performance computing (HPC) platform integrating SEMIFIVE&#8217;s CPU chiplet with a third-party I\/O chiplet into a unified package. SEMIFIVE&#8217;s HPC chiplet platform will offer notable advantages over traditional chiplet platforms to reduce cost, optimize performance, and enable development flexibility. This platform will advance semiconductor technology, leading to the creation of versatile and customized chiplets to meet the diverse needs of HPC customers.<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9baa9b4c wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p class=\"has-accent-two-color has-text-color has-link-color has-small-font-size wp-elements-6a2fce192c4c12e4b266d9ae8f2b3c07 wp-block-paragraph\"><strong>&#8220;We are confident that chiplets represent the future of silicon design. Our collaboration with Synopsys, particularly using their UCIe IP, is a key factor in ushering in the chiplet era,&#8221; said&nbsp;Brandon Cho, CEO and co-founder of SEMIFIVE. &#8220;By delivering platforms like the HPC chiplet platform, we will enable our customers to bring innovative, customized solutions to market faster than ever before.&#8221;<\/strong><\/p>\n<\/blockquote>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-small-font-size wp-block-paragraph\">SEMIFIVE&#8217;s CPU chiplet, manufactured on 4nm process technology, will include Synopsys UCIe controller and&nbsp;PHY IP&nbsp;as well as other IP solutions. Synopsys&#8217; IP solutions have helped SEMIFIVE achieve multiple generations of silicon success and become a global leader in innovative custom silicon solutions. SEMIFIVE&#8217;s portfolio of optimized SoC platforms are pre-designed and validated on advanced process nodes, allowing customers to improve their overall development efficiency.<\/p>\n<\/div>\n<\/div>\n\n\n\n<p class=\"has-small-font-size wp-block-paragraph\">&#8220;Synopsys and SEMIFIVE are helping companies adopt multi-die designs to address the growing compute demands of high-performance systems,&#8221; said&nbsp;Michael Posner, vice president of IP product management at Synopsys. &#8220;The combination of Synopsys&#8217; silicon-proven UCIe IP, which has been adopted by multiple hyperscalers, and SEMIFIVE&#8217;s extensive SoC platform, helps companies reliably meet their multi-die design requirements and accelerate their development effort.&#8221;<\/p>\n\n\n\n<p class=\"has-small-font-size wp-block-paragraph\">&#8220;We are confident that chiplets represent the future of silicon design. Our collaboration with Synopsys, particularly using their UCIe IP, is a key factor in ushering in the chiplet era,&#8221; said&nbsp;Brandon Cho, CEO and co-founder of SEMIFIVE. &#8220;By delivering platforms like the HPC chiplet platform, we will enable our customers to bring innovative, customized solutions to market faster than ever before.&#8221;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>SEOUL, South Korea,&nbsp;Nov. 12, 2024&nbsp;\/PRNewswire\/ &#8212; SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced their collaboration with Synopsys to develop a cutting-edge high-performance computing (HPC) platform integrating SEMIFIVE&#8217;s CPU chiplet with a third-party I\/O chiplet into a unified package. SEMIFIVE&#8217;s HPC chiplet platform will offer notable advantages over [&hellip;]<\/p>\n","protected":false},"featured_media":0,"template":"","class_list":["post-5590","press-releases","type-press-releases","status-publish","hentry"],"acf":{"featured_post":""},"_links":{"self":[{"href":"https:\/\/semifive.com\/ko\/wp-json\/wp\/v2\/press-releases\/5590","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/semifive.com\/ko\/wp-json\/wp\/v2\/press-releases"}],"about":[{"href":"https:\/\/semifive.com\/ko\/wp-json\/wp\/v2\/types\/press-releases"}],"wp:attachment":[{"href":"https:\/\/semifive.com\/ko\/wp-json\/wp\/v2\/media?parent=5590"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}